Circuit Boards A condition in which a hole is not completely surrounded by the land.

... correct side (mirrored or unmirrored image) legible type must be visible in an external position on the conductive pattern. 3.2 The order of layer | CIRCUIT BOARDS | construction must be given for multilayers. We are not liable for correct execution if we are not provided with this information. 4 Confusion 4.1 We | CIRCUIT BOARDS | cannot accept liability for any incorrect execution of PCBs if a file description is not provided. 5 Conversion 5.1 We are not liable for errors | CIRCUIT BOARDS | occurring as a result of converting Eagle-BRD files into gerber data. 6 Annular Ring 6.1 To guarantee an adequate annular ring encircling plated-through drills, the | CIRCUIT BOARDS | pad should have a surround of at least 300µ around the hole. 7 Pad 7.1 If non-plated holes are positioned on one pad, the pad | CIRCUIT BOARDS | must have a surround of at least 500µ larger than the hole. Otherwise some/all of the pads may be removed. 8 Solder Resists 8.1 Please | CIRCUIT BOARDS | refrain from oversizing when drafting solder resists, i.e. the solder stop spaces are 1:1 to the pads. This facilitates the ...
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... of Continental Preference for The answer to the lead-free problem could sound this simple: Immerse a printed circuit board into a solution, and the | CIRCUIT BOARDS | result is a final surface that can be stored and soldered. Completely level thanks to direct contact with the copper In fact, such a thing | CIRCUIT BOARDS | does exist: a lead-free alternative to HAL (Hot Air Levelling) with these wonderful features, at least from the point of view of the PCB manufacturer. | CIRCUIT BOARDS | OSP is an organic solution based on an imidazole substitute which, by means of dipping or rinsing can be selectively applied to the copper surfaces, | CIRCUIT BOARDS | ready for soldering. A transparent layer, max. 0.2 to 0.6 my thick, covers the copper like a barely visible clear varnish. Purely as a sealing | CIRCUIT BOARDS | agent, OSP offers good preconditions to adhere components that require an absolutely level surface, thanks to the fact that the soldering paste is applied directly | CIRCUIT BOARDS | to the copper. The common problem of twisted fine-pitch components due to raised “tin bubbles” on ...
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... routine takes longer than a conventional CNC procedure, but it is not presumptuous to claim that immediately after pressing the multi layer has the | CIRCUIT BOARDS | quality of a plated throug circuit The art of viewing chicken eggs clearly. Although the fundamental idea appears ingeniously simple, the most sophisticated German technology | CIRCUIT BOARDS | was necessary to carry it out. It was extremely complicated to develop a camera system which can not only see all spatial levels equally clearly, | CIRCUIT BOARDS | but is also able to see the lines located at different distances, and to measure them. (To give some idea of the difficulty, one could | CIRCUIT BOARDS | compare viewing a boiled egg from above and trying to see the egg cup as well as the tip of the egg clearly). The Frauenhofer | CIRCUIT BOARDS | Institute’s achievements in the development of highly intelligent camera systems was of invaluable help. Summary After completing an extended trial run to confirm the production | CIRCUIT BOARDS | capability of the entire system, we at Microcirtec now have a tool at our disposal ...
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